Pub Date: February 25, 2013
Dewey: 621.381
Lexile Code: 0000
Features: Illustrated
Target Age Group: NA to NA
Physical Info: 1.29" H x 9.21" L x 6.14" W ( 1.95 lbs) 618 pages
BISAC Categories:
Technology and Engineering | Materials Science | Electronic Materials | Electronics | Microelectronics | Science | Mechanics | Thermodynamics
Description: This book offers a comprehensive approach to advanced thermal management in electronic packaging, including the fundamentals of heat transfer, component design guidelines, materials selection, cooling, characterization, processing and manufacturing and more.