Pub Date: January 10, 2011
Dewey: 621.381
LCCN: 2011377399
Lexile Code: 0000
Features: Bibliography, Illustrated, Index, Table of Contents
Target Age Group: NA to NA
Physical Info: 1.50" H x 9.20" L x 6.20" W ( 2.30 lbs) 618 pages
BISAC Categories:
Technology and Engineering | Electronics | Microelectronics | Science | Mechanics | Thermodynamics | Materials Science | Electronic Materials
Description: This book offers a comprehensive approach to advanced thermal management in electronic packaging, including the fundamentals of heat transfer, component design guidelines, materials selection, cooling, characterization, processing and manufacturing and more.