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Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication: From Particle Scale to Feature, Die and Wafer Scales (2004) 9783540223696 by
Luo, Jianfeng -
Springer,
-2004
Dewey: 621.3815
N/A
Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication: From Particle Scale to Feature, Die and Wafer Scales 9783642061158 by
Luo, Jianfeng -
Springer,
-2010
Dewey: 621.3815
N/A