Pub Date: May 13, 2014
Dewey: 620.1
Lexile Code: 0000
Features: Illustrated
Target Age Group: NA to NA
Physical Info: 0.60" H x 9.20" L x 6.00" W ( 0.90 lbs) 174 pages
BISAC Categories:
Technology and Engineering | Materials Science | General | Mechanical | Quality Control | Science | Mechanics | Solids | Physics
Series: Advanced Structured Materials
Description: This book offers a systematic approach to assessing reliability of solder joints using Finite Element simulation, including problems in solder reflow cooling, temperature cycling and mechanical fatigue of a BGA package, mechanisms of joint fatigue and more.