Description:
Anyone involved in circuit technology will find this an absolute must-read. It's the first book to discuss the current understanding of silver metallization and its potential as a future interconnect material for integrated circuit technology.
Review Quotes:
From the reviews:
"This book is aimed at addressing and reviewing the engineering aspects of improving the thermal and electrical stability of silver with a view to use as an interconnect material in integrated circuits. ... this book can provide a quick overview of the state of the art, current trends and hurdles yet to be overcome." (Contemporary Physics, Vol. 51 (6), 2010)