Pub Date: December 23, 2008
Dewey: 620.1121
LCCN: 2008936149
Lexile Code: 0000
Features: Bibliography, Illustrated, Index
Target Age Group: NA to NA
Physical Info: 1.31" H x 9.25" L x 6.10" W ( 2.22 lbs) 560 pages
BISAC Categories:
Science | Nanoscience | Technology and Engineering | Mechanical | Industrial Design | Product | Mechanics | Solids | Structural
Description:
This text on Thermal Stresses covers linear and non-linear problems and offers a chapter on Creep Analysis due to Thermal Stresses. It also contains numerous applications, solved problems in the text, and problems at the end of each chapter.