Pub Date: June 30, 2020
Dewey: 621.381531
Lexile Code: 0000
Target Age Group: NA to NA
Physical Info: 0.90" H x 9.10" L x 6.10" W ( 1.19 lbs) 322 pages
BISAC Categories:
Computers | Hardware | Chips and Processors | Technology and Engineering | Electronics | Circuits General | Microwaves | Information Technology | Signals and Signal Processing | Materials Science | Electronic Materials
Description:
Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging presents the electromagnetic modelling and design of three major electromagnetic compatibility (EMC) issues related to the high-speed printed circuit board (PCB) and electronic packages: signal integrity (SI), power